Description
| Parameter | Value |
|---|---|
| Program Memory Size (KB) | 3.5 |
| RAM B (Bytes) | 256 |
| Number of Pins | 8 |
| CLB (Configurable Logic Block, Logic Element Count) | 32 |
| ADC Maximum Resolution (b) | 10 |
| ADC Channels | 5 |
| Configurable Logic Cells (CLC/CCL) | 4 |
| Number of Comparators | 2 |
| Independent PWMs | 4 |
| MSSP (SPI/I2C) | 1 – MSSP (SPI/I2C) |
| American Art | 1 |
| Category | Details |
|---|---|
| Core Features | C Compiler Optimized RISC Architecture Operating Speed: DC-32 MHz clock input 125 ns minimum instruction time 16-Level Deep Hardware Stack Low-Current Power-on Reset (POR) Configurable Power-up Timer (PWRT) Brown-out Reset (BOR) Low-Power Brown-out Reset (LPBOR) Windowed Watchdog Timer (WWDT) |
| Memory | Up to 14 KB of Program Flash Memory Up to 1 KB of Data SRAM Memory Memory Access Partition (MAP) with Program Flash Memory Partitioned into Application block Boot block Storage Area Flash (SAF) block Programmable Code Protection and Write Protection Device Information Area (DIA) Stores Fixed Voltage Reference (FVR) measurement data Temperature Indicator calibration coefficients Microchip Unique Identifier (MUI) Device Characteristics Information (DCI) Stores Program/erase row sizes Pin count details Direct Indirect and Relative Addressing Modes |
| Operating Characteristics | Operating Voltage Range: 1.8V to 5.5V Temperature Range: Industrial: -40°C to 85°C Extended: -40°C to 125°C |
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